AMD announces an investment of over $10 billion in Taiwan to secure advanced packaging capacity: partnering with ASE, PTI, and Inventec

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AMD announced an investment of over $10 billion in Taiwan, with partners including ASE, Powertech, Inventec, and Sanmina. This capital is not aimed at TSMC’s front-end wafer fabrication, but rather at securing the final bottleneck in AI chip production: advanced packaging capacity. (Previous coverage: AMD lets OpenAI "take a 10% stake," stock price surges 24%, declaring full-scale war on Nvidia Cuda?) (Background: Nvidia Q1 earnings are insane! Revenue hits a record $81.6 billion, Jensen Huang exclaims "The era of Agentic AI has arrived") AMD stated it will invest over $10 billion to deepen cooperation in Taiwan, with partners including ASE, Powertech, Inventec, and Sanmina. Earlier on the 21st, many people thought AI chip capacity was bottlenecked at TSMC’s wafer fabs, while overlooking back-end advanced packaging. "Advanced packaging," in plain terms, means bonding multiple chips onto a single substrate with high density, allowing them to communicate as if they were one chip. Nvidia’s H100 and A100, as well as AMD’s own MI300X, all rely on this process, which the industry calls CoWoS (Chip on Wafer on Substrate). After the wafer is produced, this process is a critical step in determining whether the chip can be shipped. From 2023 to 2025, the entire AI computing market has been repeatedly constrained by insufficient CoWoS capacity, which has also caused shipment delays for Nvidia. Taiwan’s ASE and Powertech are core players in this business. The focus of AMD’s investment is explicitly "increasing packaging capacity," aiming to lock the back-end production lines within its own capital scope. CEO Lisa Su is currently visiting Taiwan and will attend a fireside chat with the media on Friday. It is understood that in addition to attending Computex, she may also meet with TSMC Chairman C.C. Wei and key supply chain players to secure TSMC’s 2nm advanced process capacity. On the other hand, the U.S. government continues to push for the "de-Taiwanization" of the chip supply chain, and Nvidia’s H20 chip exports to China are under restriction. At this juncture, AMD’s choice to publicly declare its commitment to Taiwan is a clear move on the geopolitical chessboard: the role of the Taiwan supply chain will not change due to U.S. pressure. U.S. big tech companies’ AI spending for 2026 has already accumulated to over $700 billion. This money must eventually flow into computing power, computing power must flow into chips, chips must flow into packaging, and packaging must flow into Taiwan. The hardware competition in AI has never been just about chip design; whoever locks every step of the supply chain into their own capital map first is the only one qualified to say they intend to play the long game.

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Published:2026-05-21 07:22:53

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